Abstract:A liquid metal based high‐density interconnect technology that is capable of fabricating high resolution circuits and integrating electronic high‐density components in multilayer stretchable system, which are demonstrated by a stretchable high‐density integrated LEDs display and an eight‐electroe array of a cochlear implant. High‐density interconnect (HDI) technology for liquid metal (LM)‐based stretchable printed circuit boards is crucial for expanding their applicability. HDI technology provides high‐resolution multilayer circuits with a high density of components, as required for next generation of neuroprobes and ultrasonic and sensor arrays. This study presents a HDI technique utilizing laser engraved micro grooves in silicone with a protective lift‐off mask of polyvinyl alcohol (PVA) and subsequent microscale LM particle spray deposition. This approach achieves high‐resolution LM patterns and enables multilayer connectivity and high‐density integration of components simultaneously, that is, realizing HDI technology. It is demonstrated using a stretchable 0201 LED display with a density of six leads per mm2 and a cochlear implant (CI) electrode array. The demonstrated manufacturing of the CI has the potential to enable fully automated printed circuit board manufacturing of such implants with increased precision and throughput. Implants in guinea pigs show that the CI is capable of activating the auditory neuron with electrical auditory brainstem response (eABR) and electrical compound action potential (eCAP) of high quality. Moreover, the U‐shaped cross section of the LM interconnects provides a higher mechanical shock resistance of the circuit than that of normal rectangular cross sections.

The laser drilling of high density interconnect (HDI) technology manufacture and application

A Parameters Optimization of the CO2 Laser Drilling Process for HDI Microvia Fabrication

High Throughput Laser Nano Direct Writing Technique

Application of Ultraviolet Laser in High Density Interconection Micro Blind Via

Research on the process of Micro buried/blind Via in HDI rigid-flex PCB

Research on Laser Micro Via Processing in Rigid and Flexible Substrate Materials

Research on Manufacturing Process of Buried/Blind Via in Hdi Rigid-Flex Board

Laser Drilling of High-Density Through Glass Vias (TGVs) for 2.5D and 3D Packaging

Fabrication of through sapphire vias by femtosecond laser bidirectional drilling

Micro hole drilling of high frequency printed circuit board containing hard fillers

The study on improving microvia-filling plating

Experimental Research on CO_2 Laser Direct-writing Machining PMMA Microchannel

Etch the Borosilicate Glass to Form a Straight Through-Glass-via Based on the FLACE Technology

Research on deep RIE-based through-si-via micromachining for 3-D system-in-package integration

Smaller Microvias for Packaging Interconnects by Picosecond UV Laser With a Nanometer Metal Barrier Layer: A Feasibility Study

Fabricating research of two-depth micro blind via with copper filled in HDI PCB

Co2 Laser Induced Blind-Via for Direct Electroplating

Characterization of Micro-Holes Drilled Using a UV Femtosecond Laser in Modified Polyimide Flexible Circuit Boards

Liquid Metal‐Based High‐Density Interconnect Technology for Stretchable Printed Circuits

Research on blind via drilling using UV laser

Copper electroplating technology for microvia filling