Research on Laser Micro Via Processing in Rigid and Flexible Substrate Materials

Guoyu Zhou
2009-01-01
Abstract:The trend towards high-density interconnection(HDI) of rigid-flex board requires more fine lines and smaller diameter of plating through holes.Micro vias processing technology adapted to rigid-flex board plays a key role in rigid-flex board manufacturing process.Laser technology is commonly used in micro vias processing technology.Various factors of laser micro vias processing were analyzed in this paper,and parameters of various factors were optimized utilizing orthogonal experiments to do contradistinctive experiments.The relationship between the various factors and the substrate materials was quantificationally described by fitted equations.Parameters of laser micro vias processing were selected according to optimum equation,and perfect effect was obtained in both rigid and flexible substrate materials.
What problem does this paper attempt to address?