Abstract:Microvia interconnection technology, which mainly includes blind via and buried via, has been put forward to meet the trends of ldquofaster, lighter, reliablerdquo in electronic industry. The technology plays a crucial role in the development of low cost and high density printed circuit board (PCB). However, as the cost for raw materials, like copper, keeps increasing, one defect blind via will lead to not only failure of the whole board but great economic loss as well. The defect causes and mechanisms have been diversified due to the complexity of process, which can be traced back to material property, microvia design, manufacturing process and service environment etc.. This paper focuses on systematic failure analysis of blind vias on PCB for novel mobile phones. A series of modern analytical instruments and methods were used to observe defects of the vias. Meanwhile, focused ion beam (FIB) was adopted, for the first time, both at home and abroad, to obtain the microstructure of copper grains in the cracking interface. Characterization techniques such as FT-IR, TGA and SAM were also performed to inspect thermal stability of the bare boards. The results have shown that obvious cracking occurring along the interface of different plating layers is the main cause of open circuit; and that both sulfur impurity on wall of the vias related to incomplete desmear process and inappropriate location of the vias concerned with circuit design predominantly account for blind vias cracking. It has been revealed that the reason of the cracking generation is concerned with the sulfur segregation and the formation of brittle CuxS (1lesxles2). Moreover, the influence of warpage on the reliability of the via has also been mentioned. Based on these defaults, improvement countermeasures and suggestions have been addressed in the paper, which are of significant value for reference to the safe reliability and structural integrity of PCB products during manufacturing and servic- - es.

Research on the process of Micro buried/blind Via in HDI rigid-flex PCB

Wetting Process of Copper Filling in Through Silicon Vias

Analysis on cracking blind vias of PCB for mobile phones

Research on deep RIE-based through-si-via micromachining for 3-D system-in-package integration

Micro hole drilling of high frequency printed circuit board containing hard fillers

Failure Analysis on Blind Vias of PCB for Novel Mobile Phones

Copper electroplating technology for microvia filling

Characterization of Micro-Holes Drilled Using a UV Femtosecond Laser in Modified Polyimide Flexible Circuit Boards

Study of microvia filling process based on multi-physical coupling

Failure investigation on copper-plated blind vias in PCB

Effect of Copper Sulfate and Sulfuric Acid on Blind Hole Filling of HDI Circuit Boards by Electroplating

Pcb Related Failures in Electronic Assemblies

Micro-drilling characteristics of sequential glass fiber-reinforced resin-based/copper foil multi-layer sheets

Cryogenic auxiliary drilling of printed circuit boards

Development of conductive adhesive materials for via fill applications

Micro‐via Approaches for Reducing Solder Voiding

Investigation of through micropatterns fabrication on C194 copper foil by ultraviolet nanosecond pulsed laser microdrilling

Investigation on Chemical Etching Process of FPCB With 18 μ m Line Pitch

Fabrication of Ultra-Fine Micro-Vias in Non-Photosensitive Polyimide for High-Density Vertical Interconnects

Failure Prevention on Application of Flexible Printed Circuits

Fast copper plating process for TSV fill