Abstract:Currently, there is a need to increase the density of interconnections on printed circuit boards (PCBs). Does this mean that the only option for quality PCB manufacturing is to proportionally increase precision of equipment, or is there another way? One of the main constraints on increasing the density of PCB interconnections is posed by the transition holes. As the number of conductive layers increases, the number of vias increases and they cover a significant space on the PCB. On the other hand, reducing the size of the vias is limited by the capability of spatial alignment of the PCB stack during manufacturing. There are standards that set limits for the design of contact pads on a PCB (IPC-A-600G, IPC-6012B). However, depending on the precision of production, the contact pads may be of poor quality. This raises the issue of determining the reliability of a contact pad with defined parameters at the design stage, taking into account manufacturing capabilities. This research proposes an analytical method for evaluation of reliability of a via or plated through-hole based on calculation of its probability of production in accordance with the current standards. On the basis of the method, a model was developed both for the case of a contact pad without any conductors connected to it (nonfunctional contact pad) and for the real case with a connected conductor. The model estimates the probability of making an acceptable via for a given reliability class depending on parameters such as the conductor width (minimum permissible and usable), drilled hole diameter, and pad diameter, as well as the accuracy of the drilling operation. The analysis of the modeling results showed that for the real case, a reduction in the reliability class would insignificantly affect the probability of making an acceptable via due to the tight limitation on the connection place of the conductor and the contact pad. In conclusion, we propose an algorithm for determining the optimal parameters of teardrops to minimize the negative impact of the conductor on the reliability of the vias.

Research on Manufacturing Process of Buried/Blind Via in Hdi Rigid-Flex Board

Wetting Process of Copper Filling in Through Silicon Vias

Analysis on cracking blind vias of PCB for mobile phones

Research on deep RIE-based through-si-via micromachining for 3-D system-in-package integration

Failure Analysis on Blind Vias of PCB for Novel Mobile Phones

Pcb Related Failures in Electronic Assemblies

Effect of Copper Sulfate and Sulfuric Acid on Blind Hole Filling of HDI Circuit Boards by Electroplating

Evaluation of Nonintrusive Active Infrared Thermography Technique to Detect Hidden Solder Ball Defects on Plastic Ball Grid Array Components

Efficient DC and AC Impedance Calculation for Arbitrary-Shape and Multilayer PDN Using Boundary Integration

Development of conductive adhesive materials for via fill applications

Feasibility Study of the Application of Voltage Contrast to Printed Circuit Board

Study of microvia filling process based on multi-physical coupling

Failure investigation on copper-plated blind vias in PCB

Design and Optimization Methods of the Header of HDI PCB Rogowski Current Sensors

Failure Prevention on Application of Flexible Printed Circuits

Pre-curing investigation of filling conductive paste in prepreg to interconnect two multilayer structures of backboard for press-fit application

Micro‐via Approaches for Reducing Solder Voiding

A Manufacturing Method for High-Reliability Multilayer Flexible Electronics by Electrohydrodynamic Printing

Analytical Model for Evaluating the Reliability of Vias and Plated Through-Hole Pads on PCBs

(Invited) Study on Two Types of Embedded Components in Substrate Technology

Cryogenic auxiliary drilling of printed circuit boards