Research on blind via drilling using UV laser

YU Xiao-fei,HE Wei,WANG Shou-xu,LU Yan-hui,ZHOU Guo-yun,HU Ke,HE Bo,MO Yun-qi
DOI: https://doi.org/10.3969/j.issn.1009-0096.2011.04.014
2011-01-01
Abstract:UV laser is potential to apply in PCB micro via in advantages of short wavelength,huge energy and high processing accuracy.In this paper,UV laser was studied on drilling the blind hole with diameter at 200μm. Relationship between drilling depth and factors such as laser power,processing speed,laser frequency and the height of z-axis were analyzed by orthogonal experiment.Optimum processing parameters and methods of drilling first-order and second-order blind holes with UV laser were also achieved.Research results show that the drilling depth is deeper with the increase of laser power and processing speed,but lower when laser frequency raises.
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