Realization of Testing Wafer Bonding Quality with Cold Light Source

MA Ru-bing,SUN Hui-shu,CHEN Bin,WANG Qi,HUANG Hui,HUANG Yong-qing,REN Xiao-min
DOI: https://doi.org/10.3969/j.issn.1003-353x.2005.04.005
2005-01-01
Abstract:Using the infrared transmission theory, which is to say that the bonding part of thesample can make the light pass, and the un-bonding part of the sample will block the light, at thesame time, the unique method of cold lamp-house is used to manufacture the instrument of testingthe wafer bonding quality in order to select the high quality one for the next technical research.
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