Modeling of Anodic Bonding with SiO2 Dielectric As Interlayer

Chengwu Gao,Fang Yang,Dacheng Zhang
DOI: https://doi.org/10.1088/1361-6439/ab9d2c
2020-01-01
Journal of Micromechanics and Microengineering
Abstract:An anodic bonding model of Si/SiO2-glass is established and demonstrated. In the theoretical part, charge movement in Si/SiO2-glass anodic bonding is studied in detail. On this basis, an equivalent circuit model of anodic bonding with SiO(2)structure is established. By solving the corresponding Poisson equation, the formulas for the width of the depletion layer and the electrostatic force during Si/SiO2-glass anodic bonding are obtained. In addition, the breakdown mechanism of SiO(2)in anodic bonding is explained with 1/E model, and the breakdown type of SiO(2)is analyzed. In the experimental part, through the analysis of the anodic bonding curve, we have concluded that soft breakdown of SiO(2)occurs in the Si/SiO2-glass structure for the first time. At a temperature of 340 degrees C, for SiO(2)with a thickness of 2000 angstrom and 3400 angstrom, the soft breakdown voltages are measured as 223.4 V and 424.3 V, respectively. At the same time, through experiments of small-area bonding SiO(2)structures, the torsional bonding strength of the Si-glass structure and Si/SiO2-glass structure are measured to be 4.14 GPa and 4.94 GPa, respectively. The proposed soft breakdown model of SiO(2)provides a theoretical basis for reliable fabrication and package of MEMS devices.
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