Abstract:A laser-assisted plasma etch process is presented as an alternative to reactive ion etching for Si wafer processing in upcoming integrated circuit technology nodes. Poly-Si films were etched using an upstream 13.56 MHz inductively coupled plasma source while simultaneously being exposed to a pulsed Nd:YAG laser using the 532 nm line, with 100 Hz and 7 ns Gaussian pulse duration. For a fluorocarbon etch recipe of 50:8 sccm Ar:C4F8 with varied O2 flow, a minimum laser intensity for etch onset was necessary to overcome CFx polymer deposition in the absence of substrate bias. This etch onset occurred at 20 ± 3 mJ/cm2/pulse for 0 sccm O2 flow, dropping to 8 ± 2 mJ/cm2/pulse for 1.5 sccm O2. Beyond this onset, the etch rate increased linearly with laser intensity. Secondary ion mass spectroscopy depth profiling data showed that the no-bias 532 nm laser-assisted etch process preserved the distinction between the Si surface and the CFx polymer, with minimal uptake of etch gas residuals (C/F/O) in the Si. On the other hand, RIE showed significant straggle of the Si layer, spreading 3.5 nm through the CFx polymer layer at 1.0 W/cm2 radio-frequency bias and −140 V direct self-bias. comsol modeling of 532 nm incident on 22 nm half-pitch trench features showed strong polarization dependence, with deep-trench heating possible with polarization perpendicular to the trench line. This effect was confirmed in brief laser-assisted SF6 etching of pre-existing 50 nm half-pitch linear trenches.

Removal of Antireflection Sol-Gel SiO2 Coating Based on Ar Ion Beam Etching

Traceless Mitigation of Laser Damage Precursors on a Fused Silica Surface by Combining Reactive Ion Beam Etching with Dynamic Chemical Etching

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Isotropic Etch for SiO2 Microcantilever Release with ICP System

Removal of Particle Contaminations on Sol-Gel Coated Fused Silica Surface by Laser Cleaning

In situ plasma cleaning of large-aperture optical components in ICF

Combination of scanning ion beam etching and dynamic chemical etching for improving laser damage resistance of fused silica optics

In-situ Cleaning Organic Contaminants on SiO2 Sol-Gel Antireflection Film by Low-Pressure Air Plasma

Anisotropic Ion Beam Etching Of Fused Silica To Mitigate Subsurface Damage

Reaction ion etching process for improving laser damage resistance of fused silica optical surface

Effect of ion beam etching on surface/subsurface structural defect evolution in fused silica optics

Sol-gel Preparation of a Silica Antireflective Coating with Enhanced Hydrophobicity and Optical Stability in Vacuum

Optimum Inductively Coupled Plasma Etching of Fused Silica to Remove Subsurface Damage Layer

Reactive Ion Beam Etching of Hfo2 Film and Removal of Sidewall Redeposition

Laser Cleaning Techniques for Removing Surface Particulate Contaminants on Sol-Gel SiO 2 Films

Recovery of fused silica surface damage resistance by ion beam etching

Improve the Laser Damage Resistance of Fused Silica by Wet Surface Cleaning and Optimized HF Etch Process

Laser cleaning for inorganic thermal control coatings on aluminum alloys: Microstructure evolution and mechanical properties of substrate

Sub-damage-threshold plasma etching and profile tailoring of Si through laser-stimulated thermal desorption

Influence of Secondary Treatment with CO 2 Laser Irradiation for Mitigation Site on Fused Silica Surface

Substrate-Lossless Removal Approach Of Environmental Barrier Coatings On Sicf/Sic