Abstract:For nanotechnology nodes, the feature size is shrunk rapidly, the wire becomes narrow and thin, it leads to high RC parasitic, especially for resistance. The overall system performance are dominated by interconnect rather than device. As such, it is imperative to accurately measure and model interconnect parasitic in order to predict interconnect performance on silicon. Despite many test structures developed in the past to characterize device models and layout effects, only few of them are available for interconnects. Nevertheless, they are either not suitable for real chip implementation or too complicated to be embedded. A compact yet comprehensive test structure to capture all interconnect parasitic in a real chip is needed. To address this problem, this paper describes a set of test structures that can be used to study the timing performance (i.e. propagation delay and crosstalk) of various interconnect configurations. Moreover, an empirical model is developed to estimate the actual RC parasitic. Compared with the state-of-the-art interconnect test structures, the new structure is compact in size and can be easily embedded on die as a parasitic variation monitor. We have validated the proposed structure on a test chip in TSMC 28nm HPM process. Recently, the test structure is further modified to identify the serious interconnect process issues for critical path design using TSMC 7nm FF process.

Boundary Scan Based Interconnect Testing Design for Silicon Interposer in 2.5D ICs.

A TDR-Based Method for Pre-bond Testing of the Silicon Interposer in 2.5D ICs

A Contactless Testing Methodology for Pre-Bond Interposer

Two 10Gb/s/pin Low-Power Interconnect Methods for 3D ICs

Methods and designs for improving the signal integrity for 3D electrical interconnects in high performance IC packaging

Modeling and Characterization of On‐Chip Interconnects

Electrical Simulation and Analysis of Si Interposer for 3d Ic Integration

Test Architecture Design and Optimization for Three-Dimensional SoCs

A Shielding Structure for Crosstalk Reduction in Silicon Interposer

Interconnect characteristics of 2.5-D system integration scheme.

Double-Shielded Interposer with Highly Doped Layers for High-Speed Signal Propagation

An improved method for test chip design

A 3D Integration Testing Vehicle with TSV Interconnects

A Cost-Effective Pre-Bond Functional Test Architecture for 3d Socs

An Accurate Interconnect Test Structure for Parasitic Validation in On-Chip Machine Learning Accelerators

DfT optimization for pre-bond testing of 3D-SICs containing TSVs

Nanometer Interconnect Test Structure for Modeling of Process Variation

Modeling and Measurement of A Novel Shielding Design in Silicon Interposer

Study On Electrical Performance Of Stacking Die Package With Silicon Interposer

Redundant Vias Insertion for Performance Enhancement in 3D ICs.

Survey on Testing Methods for 3D IC