Abstract:Single crystal silicon is necessarily subjected to mechanical precision machining to fulfill its applications in semiconductor and optoelectronics industries. However, brittle defects are inevitably formed on machined surface of intrinsically single crystal silicon. Thus, achieving ductile material removal is critical to obtain ultra-smooth machined surface of single crystal silicon. In the present work, we investigate the feasibility of ductile ultra-precision machining of single crystal silicon by applying the elliptical vibration diamond cutting technology. Grooving experiments demonstrate that silicon micro groove can be successfully formed in ductile mode by employing the elliptical vibration cutting, in contrast to the ordinary cutting that causes serious deterioration of finished surface due to formation of brittle defects. Furthermore, the nominal critical depth of cut for the brittle to ductile transition in the elliptical vibration cutting of single crystal silicon is more than 12 times higher than that in the ordinary cutting. It is found that the extremely small instantaneous uncut chip thickness and small cutting forces in the elliptical vibration cutting are advantageous to suppress crack propagations. Moreover, it is found that the vibration amplitude in the depth of cut direction has a prominent influence on both the nominal critical depth of cut and the machined surface quality. Finally, based on the gained fundamental understanding of brittle to ductile transition mechanisms, two types of high precision silicon microstructures, as sinusoidal grid surface and independent dimple patterns, respectively, are successfully sculptured on single crystal silicon by applying the amplitude-controlled ductile mode sculpturing method with arbitrarily changed depth of cut.

Brittle-to-ductile Transition in Elliptical Vibration-Assisted Diamond Cutting of Reaction-Bonded Silicon Carbide

Atomistic investigation of machinability of monocrystalline 3C–SiC in elliptical vibration-assisted diamond cutting

Molecular Dynamics Simulation of Elliptical Vibration Cutting

Investigations on Brittle-Ductile Cutting Transition and Crack Formation in Diamond Cutting of Mono-Crystalline Silicon

Atomistic origin of brittle-to-ductile transition behavior of polycrystalline 3C–SiC in diamond cutting

On ductile-regime elliptical vibration cutting of silicon with identifying the lower bound of practical nominal cutting velocity

Effects of vibration trajectory on ductile-to-brittle transition in vibration cutting of single crystal silicon using a non-resonant tool

On ductile-regime elliptical vibration cutting of silicon with identifying the lower bound of practicable nominal cutting velocity

Sculpturing of single crystal silicon microstructures by elliptical vibration cutting

Cutting mechanism of reaction-bonded silicon carbide in laser-assisted ultra-precision machining

A Numerical Analysis of Ductile Deformation during Nanocutting of Silicon Carbide via Molecular Dynamics Simulation

Formation of high density stacking faults in polycrystalline 3C-SiC by vibration-assisted diamond cutting

Material removal mechanism of brittle-ductile transition in milling SiC ceramic and experimental verification

Finite Element Implementation of the Tension-Shear Coupled Fracture Criterion for Numerical Simulations of Brittle-Ductile Transition in Silicon Carbide Ceramic Grinding

A numerical study on subsurface quality and material removal during ultrasonic vibration assisted cutting of monocrystalline silicon by molecular dynamics simulation

Ductile-brittle transition mechanism of SiC particle-reinforced Al-MMCs under ultrasonic assisted grinding with single grain

Experimental Analysis of Ductile Cutting Regime in Face Milling of Sintered Silicon Carbide

Thermal softening-suppressed inter-granular embrittlement of polycrystalline 3C-SiC under diamond cutting

Diamond machining of silicon: A review of advances in molecular dynamics simulation

Effect Mechanism of Elliptic Vibration Assistance on the Cutting of Brittle Materials