Cutting mechanism of reaction-bonded silicon carbide in laser-assisted ultra-precision machining

Changlin Liu,Jinyang Ke,Tengfei Yin,Wai Sze Yip,Jianguo Zhang,Suet To,Jianfeng Xu

DOI: https://doi.org/10.1016/j.ijmachtools.2024.104219

IF: 10.331

2024-10-03

International Journal of Machine Tools and Manufacture

Abstract:Reaction-bonded silicon carbide (RB-SiC) is an important material used in aerospace optical systems. Due to the property mismatch between Si and SiC phases, the underlying cutting mechanism in ultra-precision machining of RB-SiC remains relatively unclear. Recently, laser-assisted machining (LAM) has emerged as an effective technique to enhance the machinability of hard and brittle materials, which brings another question that how the high temperature affects the machining mechanism of RB-SiC. To elucidate these aspects, a series of grooving experiments and MD simulations was conducted in this study. The interaction mechanism between phases on material removal and subsurface damage was revealed and effect of cutting temperature on Si-SiC interaction was explored. The results indicate that in conventional ultra-precision machining, the SiC grains could affect the deformation of Si phase, whereas the influence of Si phase on SiC deformation is limited. As the cutting temperature increases, the Si-SiC interaction is reduced and the deformation of Si and SiC becomes more independent. Meanwhile, the prominence of phase property mismatch on subsurface damage are reduced while extension of disordered phases into boundaries merges as an important mechanism in subsurface damage formation. This research helps to understand the thermal effect on the material interaction between phases during machining and aid to improve the performance of LAM on RB-SiC.

engineering, mechanical, manufacturing