Abstract:In order to achieve high efficiency and low damage processing of hard and brittle materials, composite ultrasonic vibration-assisted face grinding (CUVAFG) has been proposed by comprehensively combining the high efficiency of axial ultrasonic vibration grinding (UVAG) and the low damage of elliptic ultrasonic vibration grinding (EVAG). However, the three-dimensional ultrasonic vibration brings about a more complicated machining mechanism than the previous ultrasonic vibration-assisted grinding methodology. Hence, in order to explore the grinding mechanism in deep, this paper first developed a new model of undeformed chip thickness for CUVAFG from the perspectives of the kinematic mechanism and elastic-plastic deformation mechanism. Then the influences of different processing parameters on interference rate and undeformed chip thickness were further confirmed. Finally, CUVAFG experiments of silicon carbide (SiC) ceramics were conducted to study the relationship between the undeformed chip thickness and the resultant grinding forces, specific grinding energy, ground surface morphology and roughness, and subsurface damage. It is found from the experimental results that the critical chip thickness of brittle-ductile transition in CUVAFG is between 0.31 and 0.35 μm. As the undeformed chip thickness is less than the critical value, the grinding forces and the specific grinding energy increases with the undeformed chip thickness, but the ground surface roughness decreases with improved surface morphology and shallow subsurface damage. After exceeding the critical value, the grinding force remains unchanged, the specific grinding energy decreases, and ground surface roughness increases with deteriorated surface morphology and deepened subsurface damage. For the purpose of good machining surface integrity, it is essential to guarantee that the undeformed chip thickness is less than the critical value. The computational and experimental results have demonstrated the contribution of the developed undeformed chip thickness model to understanding the grinding performance of hard and brittle material by CUVAFG.

Effect Mechanism of Elliptic Vibration Assistance on the Cutting of Brittle Materials

Study on the system matching of ultrasonic vibration assisted grinding for hard and brittle materials processing

Analytical modeling of subsurface damage and material removal energy in elliptical vibration cutting of micro-structures on brittle materials

Effect of Vibration on Surface and Tool Wear in Ultrasonic Vibration-Assisted Scratching of Brittle Materials

Molecular Dynamics Simulation of Elliptical Vibration Cutting

Effects of vibration trajectory on ductile-to-brittle transition in vibration cutting of single crystal silicon using a non-resonant tool

Modeling of the Effects of Phase Shift on Cutting Performance in Elliptical Vibration Cutting

On ductile-regime elliptical vibration cutting of silicon with identifying the lower bound of practical nominal cutting velocity

On ductile-regime elliptical vibration cutting of silicon with identifying the lower bound of practicable nominal cutting velocity

Effects of Ultrasonic Vibration Assistance on Chip Formation Mechanism in Cutting of Ti–6Al–4V

Modulated ultrasonic elliptical vibration cutting for ductile-regime texturing of brittle materials with 2-D combined resonant and non-resonant vibrations

Atomistic investigation of machinability of monocrystalline 3C–SiC in elliptical vibration-assisted diamond cutting

Undeformed chip thickness with composite ultrasonic vibration-assisted face grinding of silicon carbide: Modeling, computation and analysis

A simulation of chip formation mechanism in elliptical vibration assisted cutting of nickel-based superalloy Inconel 718

Sculpturing of single crystal silicon microstructures by elliptical vibration cutting

Mathematical Model for Cutting Force in Rotary Ultrasonic Face Milling of Brittle Materials

Residual stresses in ultrasonic vibration assistance turning cemented carbide

On understanding the cutting mechanism of SiCp/Al composites during ultrasonic elliptical vibration-assisted machining

Material removal mechanism of brittle-ductile transition in milling SiC ceramic and experimental verification

Modeling the Dependency of Edge Chipping Size on the Material Properties and Cutting Force for Rotary Ultrasonic Drilling of Brittle Materials

A normal force model for ultrasonic vibration-assisted inner-diameter slicing of hard and brittle materials