Abstract:Many brittle materials, such as single-crystal materials, amorphous materials, and ceramics, are widely used in many industries such as the energy industry, aerospace industry, and biomedical industry. In recent years, there is an increasing demand for high-precision micro-machining of these brittle materials to produce precision functional parts. Traditional ultra-precision micro-machining can lead to workpiece cracking, low machined surface quality, and reduced tool life. To reduce and further solve these problems, a new micro-machining process is needed. As one of the nontraditional machining processes, rotary ultrasonic machining is an effective method to reduce the issues generated by traditional machining processes of brittle materials. Therefore, rotary ultrasonic micro-machining (RUμM) is investigated to conduct the surface micro-machining of brittle materials. Due to the small diameter cutting tool (<500 μm) and high accuracy requirements, the impact of input parameters in the rotary ultrasonic surface micro-machining (RUSμM) process on tool deformation and cutting quality is extremely different from that in rotary ultrasonic surface machining (RUSM) with relatively large diameter cutting tool (∼10 mm). Up till now, there is still no investigation on the effects of ultrasonic vibration (UV) and input variables (such as tool rotation speed and depth of cut) on cutting force and machined surface quality in RUSμM of brittle materials. To fill this knowledge gap, rotary ultrasonic surface micro-machining of the silicon wafer (one of the most versatile brittle materials) was conducted in this study. The effects of ultrasonic vibration, tool rotation speed, and depth of cut on tool trajectory, material removal rate (MRR), cutting force, cutting surface quality, and residual stress were investigated. Results show that the ultrasonic vibration could reduce the cutting force, improve the cutting surface quality, and suppress the residual compressive stress, especially under conditions with high tool rotation speed.

Effects of vibration trajectory on ductile-to-brittle transition in vibration cutting of single crystal silicon using a non-resonant tool

On ductile-regime elliptical vibration cutting of silicon with identifying the lower bound of practical nominal cutting velocity

On ductile-regime elliptical vibration cutting of silicon with identifying the lower bound of practicable nominal cutting velocity

Sculpturing of single crystal silicon microstructures by elliptical vibration cutting

Effects of ultrasonic vibration cutting trajectories on chip formation of tungsten alloys

Modulated ultrasonic elliptical vibration cutting for ductile-regime texturing of brittle materials with 2-D combined resonant and non-resonant vibrations

Brittle–ductile Transition in the Diamond Cutting of Glasses with the Aid of Ultrasonic Vibration

Atomistic investigation of machinability of monocrystalline 3C–SiC in elliptical vibration-assisted diamond cutting

Influence of Vibration Inclination on Surface Quality and Tool Wear by Ultra-Precision Vibration-Assisted Cutting

Molecular Dynamics Simulation on Cutting Mechanism in the Hybrid Machining Process of Single-Crystal Silicon

A numerical study on subsurface quality and material removal during ultrasonic vibration assisted cutting of monocrystalline silicon by molecular dynamics simulation

Influence of crystallographic effect on tool wear, cutting stress, cutting temperature, cutting force and subsurface damage in nano cutting of single crystal silicon carbide

Molecular Dynamics Analysis Micro-Mechanism Of Ductile Machining Single Crystal Silicon By Means Of Nanometric Cutting Technology

Material removal mechanism of brittle-ductile transition in milling SiC ceramic and experimental verification

Effect of temperature on the ductile-to-brittle transition in laser-assisted mechanical ruling of silicon

Effect of tool rake angle on the material removal mechanism transition of single-crystal silicon: a molecular dynamics study

Analytical modeling of subsurface damage and material removal energy in elliptical vibration cutting of micro-structures on brittle materials

Effect of Tool Rake Angle and Crystal Orientation on Ductile Mode Cutting of Hard/Brittle Materials

Theoretical and experimental investigations on rotary ultrasonic surface micro-machining of brittle materials

Developmental and Experimental Study on a Double-Excitation Ultrasonic Elliptical Vibration-Assisted Cutting Device

Atomistic origin of brittle-to-ductile transition behavior of polycrystalline 3C–SiC in diamond cutting