Abstract:Structured complex silicon components have been widely used in solar cells, biomedical engineering and other industrial applications. As silicon is a typical brittle material, ultrasonic vibration cutting (UVC) is a promising method to achieve better cutting performance than conventional techniques. High-frequency 1D UVC possesses higher nominal cutting speed and material removal rate than many 2D/3D UVC systems, and thus, it has great development potential in industrial applications of structured silicon components. However, few researchers have applied 1D UVC to the cutting of structured silicon surfaces, since its main drawback is tool marks imprinted by the vibration on machined surface. In this study, to uncover the key machining characteristics under the condition of 1D UVC, a series of tests involving diamond cutting grooves were first performed on the silicon surface. The machined surface and chips were subsequently measured and analyzed to evaluate the critical undeformed chip thickness, surface characteristics, and chip formation. Regarding the main drawback of 1D UVC, a novel theoretical model was developed for predicting the length of tool marks and evaluating the impact of tool marks on the surface finish. The results demonstrated that the critical undeformed chip thickness of silicon reached 1 030 nm under a certain vibration amplitude and that an array of micro grooves was generated at the plastic region with a surface roughness (<em class="EmphasisTypeItalic">R</em><sub>a</sub>) as low as 1.11 nm. Moreover, the micro topography of the continuous chips exhibited discontinuous clusters of lines with diameters of dozens of nanometers, only composed of polysilicon. The novel theoretical model was able to predict the length of tool marks with low error. Thus, the impact of tool marks on the surface finish can be reduced and even eliminated with help of the model.

A numerical study on subsurface quality and material removal during ultrasonic vibration assisted cutting of monocrystalline silicon by molecular dynamics simulation

Controllable Diamond Cutting of Structured Surfaces with Subnanometric Height Features on Silicon

Atomistic investigation of machinability of monocrystalline 3C–SiC in elliptical vibration-assisted diamond cutting

A Numerical Analysis of Ductile Deformation during Nanocutting of Silicon Carbide via Molecular Dynamics Simulation

Molecular Dynamics Simulation on Cutting Mechanism in the Hybrid Machining Process of Single-Crystal Silicon

Understanding the mechanism of ultrasonic vibration-assisted drilling (UVAD) for micro-hole formation on silicon wafers using numerical and analytical techniques

Effect of tool rake angle on the material removal mechanism transition of single-crystal silicon: a molecular dynamics study

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Finite element simulation and experimental research on microcutting mechanism of single crystal silicon

Molecular Dynamics Simulation on the Mechanism of Nanometric Machining of Single-Crystal Silicon

Numerical analysis of physical quantities during ultrasonic vibration assisted cutting of SiCp/Al composites

Study on the Vertical Ultrasonic Vibration-Assisted Nanomachining Process on Single-Crystal Silicon

Molecular Dynamics Analysis Micro-Mechanism Of Ductile Machining Single Crystal Silicon By Means Of Nanometric Cutting Technology

Investigation on the Edge Chipping in Ultrasonic Assisted Sawing of Monocrystalline Silicon

Molecular simulation of ultrasonic assisted diamond grit scratching 4H-SiC single-crystal

Molecular dynamics simulation of subsurface damage mechanism during nanoscratching of single crystal silicon

Experimental study on cutting force and surface quality in ultrasonic vibration-assisted milling of C/SiC composites

Numerical and experimental investigation on ductile deformation and subsurface defects of monocrystalline silicon during nano-scratching

Effect of ultrasonic vibration on polishing monocrystalline silicon: surface quality and material removal rate

Effect of UEVC parameters on cutting surface quality and subsurface damage of single crystal γ-TiAl alloy via atomic simulation

Investigations on the effect of ultrasonic vibration on fibre fracture and removal mechanism in cutting of fibre reinforced silicon carbide ceramic matrix composites