Abstract:In recent years, nanomachining has received an increasing attention because of the remarkable advancement in sciences and technologies. In nanomachining process, the atomic interaction in surface and subsurface layers plays an important role. At such a small nanoscale, the traditional continuum representation method, such as finite element method, becomes questionable. This difficulty can be solved in general by molecular dynamics (MD). MD provides the necessary insight into nanomachining process and allows researching local material properties and behaviors in detail. Based on the large scale parallel algorithm, a new three-dimensional molecular dynamics simulation model was established for nanomachining of single crystal Cu. The interactions between workpiece atoms (Cu-Cu), copper and diamond atoms (Cu-C), and diamond atoms (C-C) were described by embedded atom method (EAM), Morse and Tersoff potentials, respectively. The temperature distribution and thermal effects during nanomachining were investigated. The chip formation and nanomachining mechanism were analyzed from the point of view of dislocation theory and thermal effects. The simulation results demonstrate that both the dislocation emission and chip pileup direction are along the h110i orientation. Temperature distribution presents a roughly concentric shape and a steep temperature gradient lies in diamond tool, and the highest temperature is found in chip. The workpiece material becomes soft as the system temperature increases. Cutting speed and cutting edge radius have a significant effect on the system temperature distribution.

Molecular Dynamics Simulation on the Mechanism of Nanometric Machining of Single-Crystal Silicon

Molecular Dynamics Analysis Micro-Mechanism Of Ductile Machining Single Crystal Silicon By Means Of Nanometric Cutting Technology

Controllable Diamond Cutting of Structured Surfaces with Subnanometric Height Features on Silicon

Simulation Study of Material Deformation in Monocrystal Silicon Nano-Machining

Molecular Dynamics Simulation of Nanometric Machining

A Study on Material Removal Caused by Phase Transformation of Monocrystalline Silicon During Nanocutting Process Via Molecular Dynamics Simulation

Molecular Dynamics Simulation on Cutting Mechanism in the Hybrid Machining Process of Single-Crystal Silicon

Molecular dynamics simulations of nanomachining mechanism and thermal effects of single crystal Cu

A Numerical Analysis of Ductile Deformation during Nanocutting of Silicon Carbide via Molecular Dynamics Simulation

Diamond machining of silicon: A review of advances in molecular dynamics simulation

Investigation of machining mechanism of monocrystalline silicon in nanometric grinding

Study on nanometer cutting mechanism of single crystal silicon at different temperatures

Three-Dimensional Molecular Dynamics Modeling of Nanocutting

Numerical Investigation on Subsurface Damage in Nanometric Cutting of Single-Crystal Silicon at Elevated Temperatures

MOLECULAR DYNAMICS SIMULATIONS OF NANOMA-CHINING MECHANISM AND THERMAL EFFECTS OF SINGLE CRYSTAL Cu

Nano-Vibration Cutting Process of Single Crystal Silicon by Molecular Dynamics

MD Simulation of Stress-Assisted Nanometric Cutting Mechanism of 3C Silicon Carbide

Research on Mechanism of Nanoscale Cutting with Arc Trajectory for Monocrystalline Silicon Based on Molecular Dynamics Simulation

Molecular Dynamics Simulation of Elliptical Vibration Cutting

Molecular Dynamics Analyze on Effects of Abrasive Size and Cut Depth on the Monocrystal Silicon Grinding