Abstract:The increasing demand for designing and manufacturing micro parts with high quality comes from the high speed development of micro electromechanical systems (MEMS) and nano electromechanical systems (NEMS) in recent years. Nanometric cutting as an important machining way of micro parts has become a hot spot in machining field. Some main issues in nanometric cutting such as chip formation, machined surface quantity and diamond tool wear etc., have been investigated by molecular dynamics. Previous researchers have pointed out that, the generation and evolution of defects are mainly, responsible for causing plastic deformation of machined workpiece in nanometric cutting of plastic materials and a high compressive stress remaining in shear zone is considered beneficial to ductile-mode machining of brittle materials. Up to now, however, the influence of cutting thickness on defect behaviors and stress distribution in a workpiece and the relationship between them for single crystal materials are still unclear. In the present study, molecular dynamics simulations of nanometric cutting of single crystal Cu were performed. The simulation results show that stacking fault and partial dislocation are two main types of the defects in workpieces. A high surface stress at the atomic scale was observed in workpieces and there exist the compressive stress in shear zones and tensile stresses in the machined surfaces. It is found that the stress-distance curves of workpieces present a clear periodicity corresponding to the generation and evolution of dislocations in them. At the beginning of cutting (a small cutting thickness), no apparent stacking faults inside workpieces have been found, but with the increase of cutting thickness, the defects on surfaces and subsurfaces increase significantly and the thicker the cutting thickness, the smaller the corresponding stress components.

Molecular dynamics simulations of nanomachining mechanism and thermal effects of single crystal Cu

MOLECULAR DYNAMICS SIMULATIONS OF NANOMA-CHINING MECHANISM AND THERMAL EFFECTS OF SINGLE CRYSTAL Cu

Atomistic simulation of thermal effects and defect structures during nanomachining of copper

Molecular Dynamics Simulations of Thermal Effects in Nanometric Cutting Process

Large Scale Molecular Dynamics Study of Nanometric Machining of Copper

Nanomachining Molecular Dynamics Simulation of Single Crystal Copper

Molecular dynamic simulation for nanometric cutting of single-crystal face-centered cubic metals

MOLECULAR DYNAMICS SIMULATION OF NANOMETRIC CUTTING CHARACTERISTICS OF SINGLE CRYSTAL Cu

Nano-Cutting Molecular Dynamics Simulation of a Copper Single Crystal

Study on Machining Single-Crystal Nickel by Molecular Dynamics Simulation

Molecular Dynamics Simulation of Nanometric Machining

Molecular Dynamics Simulation of Nanometric Cutting of Polycrystalline Copper

Molecular Dynamics Simulation on the Mechanism of Nanometric Machining of Single-Crystal Silicon

Molecular Dynamics Simulation of Nanomachining Process and Mechanical Properties of Nanostructure

Molecular dynamics simulation of single crystal Nickel nanometric machining

Research on the Nanometric Machining of a Single Crystal Nickel Via Molecular Dynamics Simulation

Molecular Dynamics Simulation of Copper Processing Using AFM Pin Tool

Improving thermal stability and Hall-Petch breakdown relationship in nanocrystalline Cu: A molecular dynamics simulation study

Influences Analysis of Nanometric Cutting Single-Crystal Copper Via Molecular Dynamics Simulation

MD Simulation of Effect of Crystal Orientation and Cutting Direction on Nanometric Cutting Using AFM Pin Tool

Researching Nanometric Cutting of Copper Based on Molecular Dynamics