Nano-Cutting Molecular Dynamics Simulation of a Copper Single Crystal

Chen Jiaxuan,Wang Quanlong,Liang Yingchun,Wang Liquan,Zhang Linqi,Shang Yuanjiang

DOI: https://doi.org/10.1016/j.proeng.2012.01.515

2012-01-01

Procedia Engineering

Abstract:To investigate the nanometric cutting mechanism and removal processes of materials, molecular dynamics method is utilized to conduct single crystal copper nanomachining processes simulation, and nanocutting mechanism and removal processes are analysised by revised centro-symmetry parameter method. The results show that the cutting force of (111) orientation workpiece are largest, and that of (110) orientation workpiece is lest in the nanocutting process of single crystal copper. The average energy curves of the subsurface atoms in the workpiece are trending to rapidly ascend with local decreasing in the nanocutting process, and that in the workpiece show the decreasing trendy when the tool withdraw the workpiece. At the same time, the peak of the average energy curves of the subsurface atoms increase with the increasing cutting depths.