Abstract:The increasing demand for designing and manufacturing micro parts with high quality comes from the high speed development of micro electromechanical systems (MEMS) and nano electromechanical systems (NEMS) in recent years. Nanometric cutting as an important machining way of micro parts has become a hot spot in machining field. Some main issues in nanometric cutting such as chip formation, machined surface quantity and diamond tool wear etc., have been investigated by molecular dynamics. Previous researchers have pointed out that, the generation and evolution of defects are mainly, responsible for causing plastic deformation of machined workpiece in nanometric cutting of plastic materials and a high compressive stress remaining in shear zone is considered beneficial to ductile-mode machining of brittle materials. Up to now, however, the influence of cutting thickness on defect behaviors and stress distribution in a workpiece and the relationship between them for single crystal materials are still unclear. In the present study, molecular dynamics simulations of nanometric cutting of single crystal Cu were performed. The simulation results show that stacking fault and partial dislocation are two main types of the defects in workpieces. A high surface stress at the atomic scale was observed in workpieces and there exist the compressive stress in shear zones and tensile stresses in the machined surfaces. It is found that the stress-distance curves of workpieces present a clear periodicity corresponding to the generation and evolution of dislocations in them. At the beginning of cutting (a small cutting thickness), no apparent stacking faults inside workpieces have been found, but with the increase of cutting thickness, the defects on surfaces and subsurfaces increase significantly and the thicker the cutting thickness, the smaller the corresponding stress components.

Atomic simulation study on the effect of defects on nano-cutting mechanism of single crystal copper

Advanced Numerical Characterization of Mono-Crystalline Copper with Defects

MOLECULAR DYNAMICS SIMULATION OF NANOMETRIC CUTTING CHARACTERISTICS OF SINGLE CRYSTAL Cu

Atomistic simulation of thermal effects and defect structures during nanomachining of copper

Md Simulation of Nanocutting Process: Removal Mechanism, Defects Evolvement and Characterization

Subsurface Defect Evolution and Crystal-Structure Transformation of Single-Crystal Copper in Nanoscale Combined Machining

Molecular Dynamics Simulation of Nanomachining Process and Mechanical Properties of Nanostructure

Molecular dynamics simulations of nanomachining mechanism and thermal effects of single crystal Cu

Research on the Influence of Machining Introduced Sub-Surface Defects and Residue Stress Upon the Mechanical Properties of Single Crystal Copper

Mechanism of Material Removal and the Generation of Defects by Md Analysis in Three-Dimensional Simulation in Abrasive Processes

Effect of Fluid Media on Material Removal and Subsurface Defects Evolution of Monocrystal Copper in Nano-Cutting Process

Study on Chip Formation Mechanism of Single Crystal Copper Using Molecular Dynamics Simulations

Atomistic Simulation Study of Nanoparticle Effect on Nano-Cutting Mechanisms of Single-Crystalline Materials

Deformation Mechanism of Diamond Nanocutting Single-Crystal Copper Using Molecular Dynamics Simulatio

0701 Molecular Dynamics Simulation of Nano-Contact Between a Diamond Cutting Tool and a Copper Surface

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Influence of cutting parameters on the depth of subsurface deformed layer in nano-cutting process of single crystal copper

Effects of Cutting Parameters on the Subsurface Damage of Single Crystal Copper During Nanocutting Process

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Residual Stress Evaluation in Machined Surfaces of Copper by Molecular Dynamic Simulation