Molecular dynamics simulation on nanoindentation response of a copper workpiece

Yuan-liu Chen,Yuki Shimizu,So Ito,Wei Gao
2015-01-01
Abstract:Surface damages are caused on a workpiece by a diamond tool during the contact detection process. The contact detection process can be treated as a nanoindentation process. In order to investigate the deformation mechanism of the surface damages caused by the tool-workpiece contact, nanoindentation tests of a copper workpiece with a diamond indenter are carried out by molecular dynamics simulation. By considering the contact time between the indenter and workpiece, the dependence of the indentation shape on the holding time of tool at the maximum indentation depth are observed. In addition, the physical properties of the workpiece are also analyzed in this paper.
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