Abstract:Laser-assisted diamond machining provides a cost-effective approach for cutting hard and brittle materials. To expand its practical application, a comprehensive understanding of the design methodology of the laser-assisted diamond machining system and optimization of process parameters for machining single crystal silicon is crucial. This study presents, for the first time, an optical design methodology, with a particular emphasis on the design method for diamond cutting tools. The adequacy of the proposed method is verified through optical simulation. The numerical analysis indicates that the incident surface of the diamond cutting tool should be positioned within the Rayleigh range of the laser beam, and the optimal laser incident height is determined to be 0.7 mm. Furthermore, high-temperature nanoindentation tests reveal a significant reduction in the hardness of single crystal silicon by 72.04 % and a reduction in Young's modulus by 30.70 % at a temperature of 600 °C due to increased dislocation activity. Orthogonal experiments based on the Taguchi method reveal that the feed speed has the most significant impact on the resultant force during laser-assisted diamond machining of single crystal silicon. The contribution rates of spindle speed, feed speed, cutting depth, and laser power to the resultant force are determined to be 31.47 %, 35.82 %, 22.02 %, and 8.04 % respectively. A regression model is established through multiple nonlinear regression analysis to quantify the correlation between the input parameters and the resultant force. The optimal parametric combination is determined using nonlinear programming optimization, resulting in a spindle speed of 3061.45 rpm, a feed speed of 4 mm/min, a cutting depth of 4 μm, and a laser power of 1.5 W. Validation experiments demonstrate that the established mathematical regression model accurately forecasts the resultant force.

Controllable Diamond Cutting of Structured Surfaces with Subnanometric Height Features on Silicon

Auto-tracking Single Point Diamond Cutting on Non-Planar Brittle Material Substrates by a High-Rigidity Force Controlled Fast Tool Servo

Molecular Dynamics Simulation of Subnanometric Tool-Workpiece Contact on a Force Sensor-Integrated Fast Tool Servo for Ultra-Precision Microcutting

0706 Uctile Cutting of a Microstructure Array on Silicon Surface by Using a Diamond Tool with a Negative Rake Angle

Force Servo Nano-Precision Diamond Cutting of Freeform Surfaces on a Micro-Precision Machine

An Ultra-Precision Tool Nanoindentation Instrument for Replication of Single Point Diamond Tool Cutting Edges

Ductile Cutting of Silicon Microstructures with Surface Inclination Measurement and Compensation by Using A Force Sensor Integrated Single Point Diamond Tool

Molecular Dynamics Simulation of Elastic–plastic Deformation Associated with Tool–workpiece Contact in Force Sensor–integrated Fast Tool Servo

0701 Molecular Dynamics Simulation of Nano-Contact Between a Diamond Cutting Tool and a Copper Surface

Self-evaluation of the Cutting Edge Contour of a Microdiamond Tool with a Force Sensor Integrated Fast Tool Servo on an Ultra-Precision Lathe

Systematic Modeling and Rapid Control for Diamond Machining of Periodical Optical Surface

Development of a Force Controlled Nanocutting System Using a Flexible Mechanism for Adaptive Cutting of Microstructures on Non-Planar Surfaces

AFM Tip-Based Fabrication of Silicon Nanostructures with Reduced Subsurface Amorphous Layers

Investigation on system design methodology and cutting force optimization in laser-assisted diamond machining of single-crystal silicon

On-machine Measurement of Microtool Wear and Cutting Edge Chipping by Using a Diamond Edge Artifact

An Afm-Based Edge Profile Measuring Instrument for Diamond Cutting Tools

Scanning tunneling microscopy-based on-machine measurement for diamond fly cutting of micro-structured surfaces

A Numerical Analysis of Ductile Deformation during Nanocutting of Silicon Carbide via Molecular Dynamics Simulation

Numerical simulation of materials-oriented ultra-precision diamond cutting: Review and outlook

Feasibility investigation on ductile machining of single-crystal silicon for deep micro-structures by ultra-precision fly cutting

Molecular Dynamics Simulation on the Mechanism of Nanometric Machining of Single-Crystal Silicon