Abstract:4H-SiC (silicon carbide) is widely used in semiconductor devices due to its superior characteristics. However, processing techniques such as cutting, grinding, and polishing generally have problems such as low processing efficiency, high cost, difficulties guaranteeing processing quality, and serious material waste. The in-depth research on the mechanical behavior, material removal, and damage mechanism of SiC single crystals at the micro/nano scale is the foundation for solving these problems. This paper establishes a molecular dynamics simulation model for 4H-SiC single-crystal nano scratches, using three different directions of a Berkovich indenter to scratch the surface of the workpiece, studying the surface morphology, scratching force, and material removal during the scratching process. The results indicate that scratching directions of the tool varies, and the surface morphology also varies. After the scratching depth exceeds 1.6 nm, complete dislocations with a Burges vector of 1/3 appear on the crystal subsurface, leading to the plastic removal of the material. During the process of material removal, a smaller tool rake angle removes a larger amount of material chips. By analyzing the damage layer of the workpiece, the difference in the damage layer is smaller when the scratching direction is different, but the damage layer generated by the smaller rake angle of the scratching tool is thinner. It shows that the scratching force and workpiece temperature are relatively small when the rake angle of the scratching tool is small. Therefore, when scratching 4H-SiC single crystals, choosing a tool with a smaller rake angle is more beneficial for the process.

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