Abstract:Low temperature nanojoining has been identified as a challenging nanotechnology in the construction of nanoscale structures as well as microelectronic devices. Herein, three kinds of Ag–Cu nanopastes have been designed by mixing different organics with the Ag–Cu nanocrystalline particles synthesized in our previous work. The mechanical properties of sintered Ag–Cu nanopaste including hardness, Young’s modulus and shear strength were investigated and analyzed. It turned out that the sintered Ag–Cu nanopaste-B with 20 wt% addition of polyethylene glycol (PEG) has lower hardness and Young’s modulus, but a much higher shear strength than Ag–Cu nanopaste-A (1,2-propanediol) and -C (terpineol), which is superior to be considered as die-attach material for high temperature packaging material for wide band gap semiconductors. The uniform and dense sintered nanopaste-B layer presents a feature of eutectic microstructure comprised of Ag-rich and Cu-rich phases. It was also interesting to find that remarkable nanostructural solid solubility arose in Ag-rich phase (36 At% Cu) and Cu-rich phase (44 At% Ag). Moreover, the atomic inter-diffusion at interface could eventually interlock between the sintered nanopaste and substrate, which allows the Cu chip firmly attaching onto the Cu substrate. This work not only breaks through the synthesis bottleneck of Ag–Cu alloy NPs and a new bonding material, but also has the potential to affect a broad fields range.

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Low Temperature Bonding Process Using Mixed Cu-Ag Nanoparticles for Electronic Packaging

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Low Temperature Cu-Cu Bonding Using Ag Nanoparticles By Pvd

Bonding of Cu to Cu bulks through the low temperature sintering of Ag nanoparticle paste

Low-Temperature Cu-Cu Bonding Using Silver Nanoparticles Fabricated by Physical Vapor Deposition

Cu-Ag Nanocomposite Pastes for Low Temperature Bonding and Flexible Interlayer-Interconnections

Low Temperature Cu-Cu Bonding Using Ag Nanostructure for 3d Integration

Sintering of Mixed CuAg Nanoparticles Pretreated by Formic Acid Vapor for CuCu Low Temperature Bonding

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Cu-Cu joint formation by low-temperature sintering of self-reducible Cu nanoparticle paste under ambient condition

Cu-Cu Bonding By Ag Nanostructure At Low Temperature Of 180 Degrees C

A Novel Preparation of Ag Agglomerates Paste with Unique Sintering Behavior at Low Temperature

Cu-Cu joining using citrate coated ultra-small nano-silver pastes

Characterization of low temperature bonding with Cu nanoparticles for electronic packaging application

Cu-Cu bonding by Ag nanostructure at low temperature of 180 °C

Low Temperature Cu-Cu Bonding Using Copper Nanoparticles Fabricated by High Pressure Pvd

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Low Temperature Fine-pitch Cu-Cu Bonding Using Au Nanoparticles As Intermediate

Low Temperature Sintering-Bonding Through In-Situ Formation of Ag Nanoparticles Using Micro-Scaled Ag_2O Composite Paste