Measurement Research of Wafer Bonding Strength

NIE Lei,SHI Tie-lin,LIAO Guang-lan,TANG Zi-rong
DOI: https://doi.org/10.3969/j.issn.1001-5868.2007.01.018
2007-01-01
Abstract:Three typical manifestations of wafer bonding strength were introduced as tensile strength,shear strength and adhesive strength.The test method for each kind of strength was analyzed and related application environment was expounded.Tensile and shear strength are characterized by the form of force and main test methods for them are straight pull test,by which samples with bonding strength lower than 78.4 MPa can be tested.But the criterion of test sample preparation is strict.While adhesive strength is characterized by the form of energy which discovered the essence of bonding and DCBT can be performed to acquire the value of adhesive strength.However the test setup for adhesive strength test is more complicated and accurate relatively.As a result,tensile and shear strength test are suitable for actual production and adhesive strength is applicable in scientific research.
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