Hole Drilling of Silica Glass with Infrared Femtosecond Laser Pulses

Y Li,K Itoh,W Watanabe,J Nishii
DOI: https://doi.org/10.1109/cleopr.2001.967846
2001-01-01
Abstract:Using water to reduce the redeposition of ablation debris, high precision holes, with diameter of 4 /spl mu/m and depth over 200 /spl mu/m, were drilled from the rear surface of silica glass with infrared femtosecond laser pulses. The long holes with very small diameters had a well-defined wall without obvious taper.
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