Modeling IC Components Based on TLP I-V Curves and Transient Responses from SEED Perspective

Yize Wang,Yuan Wang,Guangyi Lu,Gang Du,Xing Zhang,Ru Huang

DOI: https://doi.org/10.1109/isemc.2018.8393904

2018-01-01

Abstract:The behavioral model based on the I-V curve of the transmission line pulse (TLP) test is practical and convenient, which is commonly used in system-efficient ESD design (SEED). However, the model only based on the I-V curve may lead to the neglect of the transient response of the relevant component. This work confirms the issue that is the neglect of the transient response by comparing the TLP test results between the hybrid-triggered and feedback active clamps. The two active clamps have nearly the same TLP I-V curves, which signify that they can be modeled by one behavioral model based only on TLP I-V data, but the TLP transient test results show that they have the different transient responses. Thus the model only extracted by the I-V curve may not be accurate enough. Furthermore, this work proposes the relevant behavioral models for the two active clamps, which take into account the transient responses in addition to TLP I-V curves. Meanwhile, the detailed analysis process is summarized in this work.