Study on the single-event burnout mechanism of GaN MMIC power amplifiers
Hao Zhang,Xuefeng Zheng,Danmei Lin,Ling Lv,Yanrong Cao,Yuehua Hong,Fang Zhang,Xiaohu Wang,Yingzhe Wang,Weidong Zhang,Jianfu Zhang,Xiaohua Ma,Yue Hao
DOI: https://doi.org/10.1063/5.0185332
IF: 4
2024-02-19
Applied Physics Letters
Abstract:In this Letter, a single-event burnout (SEB) mechanism in gallium nitride (GaN) microwave monolithic integrated circuit power amplifiers with a high linear energy transfer of 78.1 MeV·cm2/mg has been investigated in detail. A typical SEB phenomenon was observed. With the aid of photon emission measurements and scanning electron microscopy, it is found that catastrophic burnout occurs in the power-stage GaN high electron mobility transistors (HEMTs) and the metal–insulator–metal (MIM) capacitors, respectively. For the GaN HEMT, the incident heavy ions will generate electron–hole pairs within it, which can gain enough energy with the transverse high electric field. The high-energy electrons will collide with the lattice near the drain electrode and induce significant electron trapping, which will result in a significant longitudinal local electric field. When a critical electric field is achieved, catastrophic burnout occurs. For the MIM capacitor, the burnout is attributed to the single-event dielectric rupture via severe impact ionization or latent tracks when heavy ions strike it.
physics, applied