The Design and Thermal Reliability Analysis of a High-Efficiency K-Band MMIC Medium-Power Amplifier with Multiharmonic Matching

Yongheng Shang,Hui Xu,J. Mo,Zhiyu Wang,Xiuqin Xu,Z. Tu,X. Zhang,H. Zheng,W. Chen,Faxin Yu
DOI: https://doi.org/10.1155/2016/6295405
2016-01-01
Active and Passive Electronic Components
Abstract:A new high-efficiency K-band MMIC medium-power amplifier (PA) is designed with multiharmonic matching using GaAs pHEMT process technology. It has an operation frequency centered at 26 GHz with a bandwidth of 2 GHz. A 20 dBm 1 dB-compression-point output power and 40% efficiency are achieved. A novel thermal reliability analysis method based on ICEPAK is proposed also to evaluate its thermal characteristic. The test result by using a QFI InfraScope™ infrared imaging system is compared with the simulation result. It agrees well with an accuracy within ±1°C differences, which reflects the advantages of the thermal analysis method with respect to accuracy and convenience for use.
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