Abstract:The hard-to-process properties associated with high hardness and high brittleness of sapphire drastically limit the services of optics, low-damage or damage-free properties are essential to the performance of sapphire optics. To achieve efficient and damage-free sapphire optics, a series of experiments involving ultra-precision grinding, polishing, and ion beam polishing were conducted. Initially, the surface and subsurface characteristics of sapphire ultra-precision grinding were examined, and the evolution of damage during polishing was discussed. Chemical etching was performed to evaluate the subsurface damage caused by polishing, ion beam polishing was used to eliminate subsurface damage. Finally, focused ion beam (FIB) and transmission electron microscopy (TEM) were employed to analyze the atomic structure of the subsurface. The results demonstrated that ultra-precision grinding can produce a ductile grinding surface and minimize subsurface damage, the difference in grinding damage on the outside and center of the workpiece was suppressed. The evolution of the surface roughness and damage behavior during polishing varied depending on the specific grinding strategy, ultra-precision grinding decreased damage removal time by 1/4. Photothermal absorption was utilized to monitor the damage progression during the polishing process and detect the presence of subsurface damage beneath the Beilby layer. Etching revealed that the subsurface damage was primarily caused by scratches, which was effectively eliminated after ion beam polishing. High-magnification TEM images provided compelling evidence of damage at the close-to-atomic scale for sapphire optics. Only amorphous structures smaller than 2 nm were observed on the subsurface, most of the atomic structure remained intact, albeit with irregular arrangement. Additionally, the grinding marks were mitigated after polishing.

Submicron Fine Cutting-Surface of Sapphire Obtained by Chemical Corrosion Assisted Picosecond Laser Filamentation Technology

Sub-diffraction-limit fabrication of sapphire by femtosecond laser direct writing

A Method for Preparing Surface Sub-Microstructures on Sapphire Surfaces Using Femtosecond Laser Processing Technology

FEMTOSECOND LASER SCRIBING OF SAPPHIRE AT WAVELENGTH 1040 AND 520 NM

High quality stealth dicing of sapphire with a picosecond Bessel beam by controlling the polarization direction

Investigation on sapphire ablation by femtosecond-nanosecond dual beam laser

Material removal and surface formation mechanism of C-plane sapphire in multipass ablation by a nanosecond UV laser

Picosecond Laser Ablation of Millimeter-Wave Subwavelength Structures on Alumina and Sapphire

Femtosecond Laser Micro-Machining of Three-Dimensional Surface Profiles on Flat Single Crystal Sapphire

Research on sapphire micro-blind-hole machining based on femtosecond laser

Femtosecond Laser-Based Micromachining of Rotational-Symmetric Sapphire Workpieces

Surface micro-texture on sapphire fabricated by laser ablation trajectory regulation

Biomimetic sapphire windows enabled by inside-out femtosecond laser deep-scribing

Sapphire-Based Fresnel Zone Plate Fabricated by Femtosecond Laser Direct Writing and Wet Etching

Multi-focal Picosecond laser vertical slicing of 6 inch 4H-SiC ingot

Effect of different grinding strategies on subsequent polishing processes of sapphire

Sapphire Selective Laser Etching Dependence on Radiation Wavelength and Etchant

Fabrication of an Anti-Reflective Microstructure on Sapphire by Femtosecond Laser Direct Writing.

Three-dimensional femtosecond laser nanolithography of crystals

Centimeter-scale low-damage micromachining on single-crystal 4H–SiC substrates using a femtosecond laser with square-shaped Flat-Top focus spots

One-step fabrication of fine surfaces via femtosecond laser on sliced SiC