Material removal and surface formation mechanism of C-plane sapphire in multipass ablation by a nanosecond UV laser

Qiwen Wang,Quanli Zhang,Zhen Zhang,Wentao Wang,Jiuhua Xu
DOI: https://doi.org/10.1016/j.ceramint.2020.05.244
IF: 5.532
2020-09-01
Ceramics International
Abstract:<p>The material removal and the surface formation mechanism of C-plane sapphire in multipass ablation using a nanosecond laser were investigated. The surface morphology and the width and depth of the grooves under different laser-processing parameters were characterised and investigated based on an analysis of the laser energy fluence distribution in time and space, which determines the obtained depth and width of the groove. The results show that the material removal mechanism in the sapphire processed using a nanosecond UV laser was a mixture of thermal and photochemical effects. The laser thermal effect caused sublimation, vaporisation, melt, and sputtering by plasma and was characterised by the resolidified bulk area and the deposition of fine particles. Surface cracking in a certain direction to the laser scanning path was also observed because of the gradient-temperature-induced thermal stress. In addition, the photochemical effect was revealed by the obtained X-ray photon spectra, in which the appearance of a metal Al peak and a decreasing O1s peak after laser ablation indicated the photolysis of Al<sub>2</sub>O<sub>3</sub>.</p>
materials science, ceramics
What problem does this paper attempt to address?