Abstract:This work introduces a patterned laser‐induced microjet‐assisted ablation method to achieve precise ablation on difficult‐to‐machine materials. And a reliable geometrical model is established to predict the ablation process. Therefore, microgrooves with controllable cross‐sections can be fabricated by shaping the laser spot into customized patterns. This method provides a highly flexible solution for producing diverse microstructures on difficult‐to‐machine materials. Fabricating precision microgrooves with controllable cross‐sections on difficult‐to‐machine materials is significantly valuable but still challenging. Herein, a patterned laser‐induced microjet‐assisted ablation method for cross‐sectional profiles controllable laser micromachining is proposed. During the liquid‐assisted laser ablation process, debris and bubbles that may disturb the laser energy deposition can be instantaneously expelled by a directional laser‐induced microjet. The Gaussian laser spot is spatially modulated into specific geometric shapes, such as triangles, to tune locally deposited laser energy to carve microgrooves with designed cross‐sections. To achieve customized microgrooves efficiently, a reliable geometrical model based on the ablation threshold theory is developed to guide the processing parameter selection, including the laser spot shape, polarization, pulse energy, and scanning strategies. The simulation and experimental results confirm that this method achieves the decoupled control of the groove depth and width in a single‐path laser ablation process. Using this method, the design and manufacturing of microgrooves with controllable cross‐sections on single crystalline silicon carbide are demonstrated. The patterned laser‐induced microjet‐assisted ablation method provides a new route for fabricating precision microgrooves with controllable cross‐sections on difficult‐to‐machine materials.

Surface micro-texture on sapphire fabricated by laser ablation trajectory regulation

Investigations in the fabrication of surface patterns for wettability modification on a Zr-based bulk metallic glass by nanosecond laser surface texturing

Material removal and surface formation mechanism of C-plane sapphire in multipass ablation by a nanosecond UV laser

A Method for Preparing Surface Sub-Microstructures on Sapphire Surfaces Using Femtosecond Laser Processing Technology

Femtosecond Laser Micro-Machining of Three-Dimensional Surface Profiles on Flat Single Crystal Sapphire

Sub-diffraction-limit fabrication of sapphire by femtosecond laser direct writing

Surface microstructuring of single crystalline diamond based on the accumulated energy homogenization in the nanosecond pulsed laser ablation

Fabrication of an Anti-Reflective Microstructure on Sapphire by Femtosecond Laser Direct Writing.

Longitudinal-torsional compound ultrasonic vibration end grinding sapphire: A study on surface topography and roughness

Crystalline Flat Surface Recovered by High-Temperature Annealing after Laser Ablation

High quality stealth dicing of sapphire with a picosecond Bessel beam by controlling the polarization direction

Sapphire-Based Fresnel Zone Plate Fabricated by Femtosecond Laser Direct Writing and Wet Etching

Biomimetic sapphire windows enabled by inside-out femtosecond laser deep-scribing

Effect of different grinding strategies on subsequent polishing processes of sapphire

Ultrasonic vibration-assisted scratch-induced characteristics of C-plane sapphire with a spherical indenter

Fabrication of Interference Textures on Cemented Carbides Using Nanosecond and Femtosecond Laser Pulses

Multiphoton Absorption Simulation of Sapphire Substrate under the Action of Femtosecond Laser for Larger Density of Pattern-Related Process Windows

Infrared Pulsed Picosecond Laser-Induced Plasma-Assisted Ablation of Micro-textures on Quartz Surface

Hydrophobic texture screening of laser ablated silicon carbide surface and its influencing factors analysis and optimization

FEMTOSECOND LASER SCRIBING OF SAPPHIRE AT WAVELENGTH 1040 AND 520 NM

Patterned Laser Ablation of Microgrooves with Controllable Cross‐Sections