DRIE Trenches and Full-Bridges for Improving Sensitivity of 2-D Micromachined Silicon Thermal Wind Sensor

Yizhou Ye,Zhenxiang Yi,Shixuan Gao,Ming Qin,Qing-An Huang
DOI: https://doi.org/10.1109/JMEMS.2017.2707558
IF: 2.829
2017-01-01
Journal of Microelectromechanical Systems
Abstract:This paper presents the design, fabrication, and performance of a micromachined silicon thermal wind sensor with improved sensitivity. Deep reactive ion etching (DRIE) trenches are fabricated between the heater and the thermistors to suppress the lateral heat conduction in the chip. In addition, eight thermistors symmetrically arranged in four directions around the heater form two Wheatstone full-...
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