First Foundry Platform Of Complementary Tunnel-Fets In Cmos Baseline Technology For Ultralow-Power Iot Applications: Manufacturability, Variability And Technology Roadmap
Qianqian Huang,Rundong Jia,Cheng Chen,Hao Zhu,Lingyi Guo,Junyao Wang,Jiaxin Wang,Chunlei Wu,Runsheng Wang,Weihai Bu,Jing Kang,Wenbo Wang,Hanming Wu,Shiuh-Wuu Lee,Yangyuan Wang,Ru Huang
DOI: https://doi.org/10.1109/IEDM.2015.7409756
2015-01-01
Abstract:We have first manufactured Complementary Tunnel-FETs (C-TFETs) in standard 12-inch CMOS foundry. With abrupt tunnel junction consideration for improved TFET performance, technology of monolithically integrating C-TFET with CMOS is developed. Planar Si C-TFET inverter is also demonstrated, indicating a new electrical isolation requirement between neighboring devices for practical C-TFET integration on bulk substrate. For high-volume production, the variability of C-TFETs are experimentally investigated, demonstrating an intrinsic trade-off between performance enhancement and variability suppression induced by dominant variation source in traditional TFETs, which is mainly impacted by the band-to-band tunneling generation area. By new TFET device design, improved performance and variability simultaneously are experimentally achieved, and circuit-level implementation shows significant operation speed enhancement (up to 93%) and energy reduction (by 66%) at V-DD of 0.4V, as well as remarkably suppressed variation, indicating its great potential for ultralow-power applications.