Step JTE, an Edge Termination for UHV SiC Power Devices with Increased Tolerances to JTE Dose and Surface Charges

Cai-Neng Zhou,Yan Wang,Rui-Feng Yue,Gang Dai,Jun-Tao Li
DOI: https://doi.org/10.1109/ted.2017.2648886
2017-01-01
Abstract:An edge termination method, referred to as guard-ring-assisted multistep junction termination extension (MS-GR-JTE), is presented for ultrahigh voltage silicon carbide (SiC) power devices. In comparison with other JTEs, the MS-GR-JTE creates a step electric field (EF) distribution with greatly reduced peak EF at the corners and edges of the device, resulting in a superior breakdown voltage (BV) performance with wide tolerances to JTE dose and SiC surface charges. According to the numerical simulations based on a 100-mu m-thick epilayer, an optimized MS-GR-JTE shows that the 15-kV BV performance with wide tolerances of 1.3 x 10(12) cm(-2) to JTE dose and 6.1 x 10(12) cm(-2) to positive surface charges are obtained, respectively, both superior to other compared JTEs.
What problem does this paper attempt to address?