Evaulation the Degradation in Nmosfets with HfO2 Gate Dielectric and Interfacial Layer by 3D Kinetic Monte-Carlo Method

Yun Li,Zhiyuan Lun,Yijiao Wang,Peng Huang,Hai Jiang,Xing Zhang,Gang Du,Xiaoyan Liu
DOI: https://doi.org/10.1109/snw.2016.7578048
2016-01-01
Abstract:This paper evaluates the degradation process in nMOSFETs with HfO 2 gate dielectric and interfacial layer (IL) by 3D Kinetic Monte-Carlo (KMC) method considering multi-trap coupling. The degradation and corresponding trap evolution in a 1-nm EOT dielectric stack with different thicknesses of SiO 2 IL is simulated under different gate biases (V g ) and temperature (T). The results indicate that IL can suppress the positive bias temperature instability (PBTI) but increase the gate leakage and weaken the capability to endure stress.
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