Abstract:Thermal issue has significant effect on the reliability and performance of integrated circuits (ICs) with the increase of integrated density, especially for 2.5-D and 3-D heterogeneous integration packaging systems. In this paper, a new highly efficient 3-D transient thermal distribution model has been constructed to capture the heat conduction behavior of multiple heat sources for chiplet heterogeneous integration (CHI) by improving the alternating direction implicit finite difference method (ADI-FDM). Firstly, a new floating optimization algorithm (FOA) of coefficient matrix assignment of heat conduction equation and a new boundary treatment utilizing virtual points are proposed to modify the ADI-FDM and improve the model efficiency of thermal analysis. Furthermore, a universal equivalent thermal conductivity model is also built up to describe the design features of through silicon via (TSV), bump and redistribution layer structures, which can enhance the flexibility of FDM-based thermal simulator. Compared with previous finite element analysis results, the present FOA-accelerated thermal model can not only obtain an accurate simulation result of temperature profile, but also give a simulation efficiency of 3.74 times faster than Douglas-Gunn approach for the coefficient matrix assignment. Finally, the effect of power consumption variation and the floorplaning effects of chiplets, TSVs and bumps on the temperature distribution are investigated in detail by utilizing the present FOA-based thermal solver. The simulated results of the present work demonstrate the viability and computational efficiency for temperature field optimization and indicate that the new proposed simulator is helpful in thermal analysis of packaging structures and can be adopted to assist in physical design optimization of 2.5-D CHI or 3-D heterogeneous stacked chips.

Fast Transient Thermal Simulation of 2.5-D Packages on Through Silicon Via Interposer

Electrical-Thermal Co-Simulation For Through Silicon Via And Active Tier In 3-D Ic

Lumped 3-D Equivalent Thermal Circuit Model for Transient Thermal Analysis of TSV Array

High-Frequency Electrothermal Characterization of TSV-Based Power Delivery Network

Electrothermal modelling of through silicon via (TSV) interconnects

System-Level Analysis of 3D ICs with Thermal TSVs

Efficient Transient Thermal Analysis of Chiplet Heterogeneous Integration

The Development of Effective Model for Thermal Conduction Analysis for 2.5D Packaging Using TSV Interposer

Fast Thermal Simulation of Integrated Systems Using Alternating-Direction-implicit Method

Thermal analysis and heat dissipation optimization of 3D packaging with TSV interposer

An Effective Approach for Thermal Performance Analysis of 3-D Integrated Circuits with Through-Silicon Vias

Thermal Modeling of a Chiplet-Based Packaging with a 2.5-D Through-Silicon Via Interposer

Parallelized ADI Method for Transient Electro-Thermal Simulation of On-Chip Interconnects

Fast Simulation of Nonuniform Substrate Temperature Effects on Global GSI Interconnects

An Efficient ADI Method for Transient Thermal Simulation of Liquid-Cooled 3-D ICs

Multiphysics Characterization of Large-Scale Through-Silicon-via Structures

Thermal-aware electrical analysis of high-speed interconnect

An Effective Approach for Thermal Performance Analysis of Three-Dimensional Integrated Circuits with Through-Silicon Vias

Thermal Performance of 2.5D Packaging with the Through Glass Via (TGV) Interposer

Thermal Modeling of Three-Dimensional Integrated Circuits Considering the Thermal Removal Capability of Different TSVs

Electrical–Thermal Cosimulation of Coaxial TSVs with Temperature-Dependent MOS Effect Using Equivalent Circuit Models