Study on Thermal Annealing Behavior of Nd Ion Implanted Silicon by Deep Level Transient Spectroscopy

刘磁辉,林碧霞,王晓平,刘宏图,傅竹西
DOI: https://doi.org/10.3969/j.issn.1000-985X.2003.05.016
2003-01-01
Abstract:The different dose of rare earth Nd ion was implanted into n-type silicon, and the samples were annealed by using rapid thermal annealing method. It was investigated that the thermal annealing behavior of rare earth Nd ion in the n-type silicon by deep level transient spectroscopy (DLTS). The results indicate that the deep levels formed by Nd ion in silicon depend on the dose and annealing temperature. When the annealing temperature is lower than 1285℃, the deep level is changed with the dose of Nd and the annealing temperature. After high temperature annealing, only one donor-like deep level at Ec-(0.32 ± 0.04)eV can be observed stably, which is similar to the level of Nd with large dose annealed at lower temperature. This deep level may be ascribed to the rare earth oxided formed in RTA process.
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