Room-Temperature Wafer Bonded Ingap/Gaas//Ingaasp/Ingaas Four-Junction Solar Cell Grown by All-Solid State Molecular Beam Epitaxy

Pan Dai,Shulong Lu,Shiro Uchida,Lian Ji,Yuanyuan Wu,Ming Tan,Lifeng Bian,Hui Yang
DOI: https://doi.org/10.7567/apex.9.016501
IF: 2.819
2016-01-01
Applied Physics Express
Abstract:An InGaP/GaAs tandem cell on a GaAs substrate and an InGaAsP/InGaAs tandem cell on an InP substrate were grown separately by all-solid-state molecular beam epitaxy. A room-temperature direct wafer-bonding technique was used to integrate these subcells into an InGaP/GaAs//InGaAsP/InGaAs wafer-bonded solar cell, which resulted in an abrupt interface with low resistance and high optical transmission. The current-matching design for the base layer thickness of each cell was investigated. The resulting efficiency of the four-junction solar cell was 42.0% at 230 suns, which demonstrates the great potential of the room-temperature wafer-bonding technique to achieve high conversion efficiency for cells with four or more junctions. (C) 2016 The Japan Society of Applied Physics
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