Effect of Post Treatment For Cu-Cr Source/Drain Electrodes on a-IGZO TFTs.

Shiben Hu,Zhiqiang Fang,Honglong Ning,Ruiqiang Tao,Xianzhe Liu,Yong Zeng,Rihui Yao,Fuxiang Huang,Zhengcao Li,Miao Xu,Lei Wang,Linfeng Lan,Junbiao Peng
DOI: https://doi.org/10.3390/ma9080623
IF: 3.4
2016-01-01
Materials
Abstract:We report a high-performance amorphous Indium-Gallium-Zinc-Oxide (a-IGZO) thin-film transistor (TFT) with new copper-chromium (Cu-Cr) alloy source/drain electrodes. The TFT shows a high mobility of 39.4 cm(2).V-1.s(-1) a turn-on voltage of -0.8 V and a low subthreshold swing of 0.47 V/decade. Cu diffusion is suppressed because pre-annealing can protect a-IGZO from damage during the electrode sputtering and reduce the copper diffusion paths by making film denser. Due to the interaction of Cr with a-IGZO, the carrier concentration of a-IGZO, which is responsible for high mobility, rises.
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