Experimental Investigation into Radiation-Hardening-by-design (RHBD) Flip-Flop Designs in a 65nm CMOS Process

Tong Lin,Kwen-Siong Chong,Wei Shu,Ne Kyaw Zwa Lwin,Jize Jiang,Joseph S. Chang
DOI: https://doi.org/10.1109/iscas.2016.7527403
2016-01-01
Abstract:We comprehensively study three types of radiation-hardened flip-flops: DICE for SEU-hardening, temporal for SET-hardening, and Triple-Modular-Redundancy for SEU-cum-SET-hardening. Our study includes their trade-offs of circuit/radiation-hardness attributes. We find that DICE flip-flops remain the most competitive.
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