Low On-Resistance Normally-Off GaN Double-Channel Metal–Oxide–Semiconductor High-Electron-Mobility Transistor

Jin Wei,Shenghou Liu,Baikui Li,Xi Tang,Yunyou Lu,Cheng Liu,Mengyuan Hua,Zhaofu Zhang,Gaofei Tang,Kevin J. Chen
DOI: https://doi.org/10.1109/led.2015.2489228
IF: 4.8157
2015-01-01
IEEE Electron Device Letters
Abstract:A low on-resistance normally-off GaN double-channel metal-oxide-semiconductor high-electron-mobility transistor (DC-MOS-HEMT) is proposed and demonstrated in this letter, which features a 1.5-nm AlN insertion layer (ISL) located 6 nm below the conventional barrier/GaN interface, forming a second channel at the interface between the AlN-ISL and the underlying GaN. With gate recess terminated at the upper channel, normally-off operation was obtained with V-th of + 0.5 V at I-DS = 10 mu A/mm or +1.4 V from the linear extrapolation of the transfer curve. The lower heterojunction channel is separated from the etched surface in the gate region, thereby maintaining its high field-effect mobility with a peak value of 1801 cm(2)/(V.s). The on-resistance is as small as 6.9 Omega.mm for a DC-MOS-HEMT with L-G/L-GS/L-GD = 1.5/2/15 mu m, and the maximum drain current is 836 mA/mm. A high breakdown voltage (>700 V) and a steep subthreshold swing of 72 mV/decade are also obtained.
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