Phase formation and stability of Cu-Ge films with low electrical resistivity

j s fang,c j cai,j h lee,t s chin
DOI: https://doi.org/10.1016/j.tsf.2015.01.013
IF: 2.1
2015-01-01
Thin Solid Films
Abstract:This study presents an evaluation of copper germanide (Cu-Ge) thin films with low resistivity and high thermal stability. The films were prepared on glass and Si substrates via magnetron co-sputtering deposition and were subsequently annealed at temperatures between 300 and 600°C. The results indicated that Cu17Ge3 and Cu3Ge phases were formed in films deposited at different sputtering powers using a Cu target and a Ge target. The Cu3Ge phase had a monoclinic structure and reached a low resistivity of 12.4μΩcm when the film was annealed at 600°C. This low resistivity in combination with a high-oxidation resistance makes the Cu3Ge film suitable for application in Cu interconnections.
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