Slow Crack Growth Behavior of 3Y-TZP in Cryogenic Environment Using Dynamic Fatigue and Indentation Technique

Jingya Gui,Sai Wei,Zhipeng Xie,Weijiang Xue,Guanwei Liu
DOI: https://doi.org/10.1016/j.msea.2015.03.099
IF: 6.044
2015-01-01
Materials Science and Engineering A
Abstract:The dynamic fatigue of 3mol% Y2O3 stabilized tetragonal zirconia ceramic (3Y-TZP) was assessed at 293K and 77K by testing the same batch of specimens in four-point flexure at various stress rates. The crack propagation velocities were also measured using Vickers indentation specimens under dynamic-loading conditions in ambient and cryogenic environment. The slow crack growth (SCG) parameter n at 77K was larger than that at 293K. Also, the crack propagation velocity under cryogenic circumstance is much slower than that under ambient circumstance. The experimental results suggest that the 3Y-TZP exhibits a lesser degree of SCG behavior in cryogenic environment. It should be ascribed to two reasons. The negligible effect of stress corrosion and crack tip shielding mechanism induced by temperature. The high SCG resistance in cryogenic environment makes the 3Y-TZP a promising candidate material for long-term service in cryogenic structural applications.
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