Abstract:Patterned nanostructure materials have important applications in photonic crystals, SERS, micro / nanodevices etc [ 1 ] . Conventional nanofabrication technologies for the patterned nanostructures mainly rely on semiconductor micromachining techniques, such as photo and electron beam lithography [ 2, 3 ] . Due to the light diffraction limit and poor throughput, these conventional lithography techniques are reaching their resolution limits and have relatively high costs. Unconventional lithography techniques including colloidal lithography [ 4, 5 ] , self-assembly [ 6, 7 ] etc. thus appear to meet increasing demand for nanofabrication with smaller features, lower cost and more complicated geometries. This focus collection introduces recent advances in unconventional lithography for understanding [ 8 ] . Imbraguglio and Perego et al developed a route to prepare periodic Si nanostructures based on diblock copolymer ( DBC ) masks and reactive ion etching ( RIE ) and investigated the in ﬂ uence of the feature size on the etch rate of Si [ 9 ] . The decrease of the etch depth and etch rate was observed in the mask with the smallest feature size. They transferred the nanometric cylindrical pattern in DBC into a Si substrate. They also investigated the structural and physicochemical in ﬂ uences on the resulting nanostructured Si in order to delineate of various RIE pattern effects. They successfully realized the sub 20 nm features on silicon substrate. Borah et al demonstrated an effective approach to fabricate nanoscale silicon patterns by transferring the PDMS cylindrical and spherical patterns to underlying silicon by an etching processes, which showed promise in guiding self-assembly and

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