Investigation Of Fast Diffusing Impurities In Silicon By A Transient Ion Drift Method

a zamouche,t heiser,a mesli
DOI: https://doi.org/10.1063/1.114142
IF: 4
1995-01-01
Applied Physics Letters
Abstract:Transient ion drift in a depletion region of a Schottky barrier has been used to investigate Cu diffusion in boron or aluminum doped silicon. It is shown that in the investigated temperature range, the Cu-boron pairing is negligible, while for the other acceptors it is well described by a Coulombic interaction. In order to test the validity of the model used to extract the diffusion coefficient, the method has been applied to the well-known Li diffusion in silicon. For both Li and Cu ions, an excellent agreement with literature diffusivity data was obtained.
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