Investigation of the Doping Profile for Ion Implants and Rapid Annealing in Silicon Via an Improved Method

Ya Wang,Zhenhui Wang,Zeqi Zha
DOI: https://doi.org/10.1109/CSTIC58779.2023.10219243
2023-06-26
Abstract:Nowadays, applications of ion implantation and rapid annealing in semiconductor fabrication are widespread. The doping profile in silicon determines the depth and lateral spread of p-n junctions. An optimal combination of ion implantation and annealing conditions for tuning the electrical properties of device usually takes a lot of time and money. In this paper, we present a cheap and efficient method for investigation the implanted impurity distribution on Sentaurus TCAD tools. The simulated boron/phosphorus/arsenic doping profiles are in good agreement with SIMS measurements for a wide range of implant energies and annealing temperature. In addition, the simulation of resistance in different depths is also investigated.
Engineering,Materials Science,Physics
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