Abstract:This paper presents an accurate and systematic approach for analysis of the signal integrity of the high-speed interconnects, which couples the full-wave finite difference time domain (FDTD) method with scattering (S) parameter based macromodeling by using rational function approximation and the circuit simulator. Firstly, the full-wave FDTD method is applied to characterize the interconnect subsystems, which is dedicated to extract the S parameters of the subnetwork consisting of interconnects with fairly complex geometry. Once the frequency-domain discrete data of the S parameters of the interconnect subnetwork is constructed, the rational function approximation is carried out to establish the macromodel of the interconnect subnetwork by employing the vector fitting method, which provides a more robust and accurate solution for the overall problem. Finally, the analysis of the signal integrity of the hybrid circuit can be fulfilled by using the S parameters based macromodel synthesis and simulation program with integrated circuits emphasis (SPICE) circuit simulator. Numerical experiments demonstrate that the proposed approach is accurate and efficient to address the hybrid electromagnetic (interconnect part) and circuit problems, in which the electromagnetic field effects are fully considered and the strength of SPICE circuit simulator is also exploited.

Analytical Interconnect Modeling Based on Equivalent Circuit Method

An Equivalent Circuit Model with Current Return Path Effects for On-Chip Interconnect Up to 80 Ghz

Modeling and Characterization of On‐Chip Interconnects

Wideband lumped element model for on-chip (a)symmetrical coupled interconnects on lossy silicon substrate

Equivalent Circuit Model of On-Wafer Interconnects for Cmos Rfics

Wideband Circuit Model of Silicon-Based Interconnects Up to 50 GHz

A Physics-Aware Methodology for Equivalent Circuit Model Extraction of TSV-inductors

Scalable Model of On-Wafer Interconnects for High-Speed CMOS ICs

Fully Analytical Modeling of Cu Interconnects up to 110 GHz

Analytical Modeling of Metal-Insulator-Semiconductor Interconnects Using the Energy Based Approach

Accurate Model Of Metal-Insulator-Serniconductor Interconnects

A Coupled Efficient and Systematic Full-Wave Time-Domain Macromodeling and Circuit Simulation Method for Signal Integrity Analysis of High-Speed Interconnects

Equivalent Circuit Model of On-Wafer CMOS Interconnects for RFICs.

Wideband Lumped Element Model for On-Chip Interconnects on Lossy Silicon Substrate

Finite-difference Time-Domain Macromodel for Simulation of Electromagnetic Interference at High-Speed Interconnects

A SPICE-compatible Full-Wave Equivalent Circuit Model for Printed Circuit Structure Analysis

A system-level equivalent circuit method for the electrical performance modeling of electronic packages

An efficient finite element solution using a congruent transformation based model order reduction for interconnect simulation

A Wideband Scalable and SPICE-Compatible Model for On-Chip Interconnects Up to 110 GHz

Analysis of Signal Propagation on High‐speed Planar Interconnect Systems Based on Full‐wave and Macromodeling Techniques

A Wideband Scalable and SPICE-Compatible Model for On-Chip Interconnects Up to 80 GHz