Fully Analytical Modeling of Cu Interconnects up to 110 GHz

Jun-De Jin,Shawn S. H. Hsu,Tzu-Jin Yeh,Ming-Ta Yang,Sally Liu
DOI: https://doi.org/10.1143/jjap.47.2473
IF: 1.5
2008-04-25
Japanese Journal of Applied Physics
Abstract:Copper interconnects with and without the grounded shielding on the silicon substrate are modeled from 1 to 110 GHz. The fully-analytical model is composed of the cascaded lumped resistor–inductor–conductor–capacitor (RLGC) circuit elements with 20 sections, and featured physical-based, scalable, and frequency-dependent characteristics. An excellent agreement is obtained between the measured, simulated, and modeled S-parameters without any optimization procedure. The proposed approach can be applied for interconnect modeling for integrated-circuits over a wide frequency range.
physics, applied
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