Abstract:This paper presents an accurate and systematic approach for analysis of the signal integrity of the high-speed interconnects, which couples the full-wave finite difference time domain (FDTD) method with scattering (S) parameter based macromodeling by using rational function approximation and the circuit simulator. Firstly, the full-wave FDTD method is applied to characterize the interconnect subsystems, which is dedicated to extract the S parameters of the subnetwork consisting of interconnects with fairly complex geometry. Once the frequency-domain discrete data of the S parameters of the interconnect subnetwork is constructed, the rational function approximation is carried out to establish the macromodel of the interconnect subnetwork by employing the vector fitting method, which provides a more robust and accurate solution for the overall problem. Finally, the analysis of the signal integrity of the hybrid circuit can be fulfilled by using the S parameters based macromodel synthesis and simulation program with integrated circuits emphasis (SPICE) circuit simulator. Numerical experiments demonstrate that the proposed approach is accurate and efficient to address the hybrid electromagnetic (interconnect part) and circuit problems, in which the electromagnetic field effects are fully considered and the strength of SPICE circuit simulator is also exploited.

Scalable Model of On-Wafer Interconnects for High-Speed CMOS ICs

Modeling and Characterization of On‐Chip Interconnects

An Equivalent Circuit Model with Current Return Path Effects for On-Chip Interconnect Up to 80 Ghz

Wideband lumped element model for on-chip (a)symmetrical coupled interconnects on lossy silicon substrate

Equivalent Circuit Model of On-Wafer Interconnects for Cmos Rfics

Wideband Circuit Model of Silicon-Based Interconnects Up to 50 GHz

A Wideband Model for On-Chip Interconnects with Different Shielding Structures

Equivalent Circuit Model of On-Wafer CMOS Interconnects for RFICs.

Scalable RFCMOS Model for 90 Nm Technology

Complex Shaped On-Wafer Interconnects Modeling for CMOS RFICs

A Wideband Scalable and SPICE-Compatible Model for On-Chip Interconnects Up to 110 GHz

A Wideband Scalable and SPICE-Compatible Model for On-Chip Interconnects Up to 80 GHz

Modeling and Characterization of Carbon-Based Heterogeneous Interconnects for 3-D Ics

Analytical Interconnect Modeling Based on Equivalent Circuit Method

Wideband Lumped Element Model for On-Chip Interconnects on Lossy Silicon Substrate

A Coupled Efficient and Systematic Full-Wave Time-Domain Macromodeling and Circuit Simulation Method for Signal Integrity Analysis of High-Speed Interconnects

Investigating the Frequency Dependence Elements of CMOS RFIC Interconnects for Physical Modeling

Analysis of Signal Propagation on High‐speed Planar Interconnect Systems Based on Full‐wave and Macromodeling Techniques

Characterization and Modeling of Cmos On-Chip Coupled Interconnects

Accurate and Scalable RF Interconnect Model for Silicon-Based RFIC Applications

High-Frequency Modeling of On-Chip Coupled Carbon Nanotube Interconnects for Millimeter-Wave Applications