Abstract:This Paper reports the design, simulation and test of 3D microchannel networks intended for the 3D IC stackup cooling, vacuum building and even THz passive device applications. Recently, the prominent advantages of 3D IC integration, including reduction in system size, interconnect delay, power dissipation and enabling hyper-integration of chips from disparate process technologies, have drive the relentless research effort worldwide. Although various low-power methodologies are exploited, rapid increasing in device packing density in 3D stacking of chips have demanded revolutionary heat removal technologies, as high performance chips projected to dissipate more than 100W/cm(2) and require more than 100A of supply current are frequently integrated. Besides, high data rate and bandwidth interconnects are urgently needed as an efficient data transfer backbone between the chips comprising 3D ICs. To address these limits, the authors investigated 3D microchannel networks with various layouts such as fractal tree, which is embedded into stackup structures for highly efficient cooling, and as THz (terahertz) range waveguides.The 3D microchannel networks, with water as working medium are designed and simulated with computational fluidic dynamic methodology, which reveals both the flow and temperature fields and verifies their effectiveness in 3D stackup structure cooling. The 3D microchannels are further experimentally validated on a fast microsystem prototyping platform based on laminating multiple layers of Low Temperature Cofired Ceramic plates, which is capable of quickly realizing a complex exterior or interior 3D structures, for experimental validation. A testing system is set up, consisting of resistive heating source, temperature pickup device and microfluidic metering pumping devices. The temperature rises for samples with or without 3D microchannels with different configurations under various heat flux are obtained and compared with simulated results. The testing results shows that this embedded microfluidic cooling technique may effectively realized a decrease of around 60 centigrade at a heat flux of 1W/cm(2) and increase with the flux, confirming the effectiveness of this 3D microchannel in cooling a stackup structure and that of the simulation and modeling. Beside the microchannel, combined with sealed pipe I/O joints may effectively act as a ventilation pumping path for the vacuum buildup, adjustment and vacuum level inspection for 3D IC vacuum packaging.In addition, the authors present the investigations of the conceptional design of waveguide and functional structures operating at terahertz frequencies, together with the simulation results which demonstrate the prosperity of this simple structure for high data rate transmission in 3D IC stackups.

Thermal Characterization of Tsv Array As Heat Removal Element in 3d Ic Stacking

System-Level Analysis of 3D ICs with Thermal TSVs

High-Frequency Electrothermal Characterization of TSV-Based Power Delivery Network

Electrothermal Effects in High Density Through Silicon Via (tsv) Arrays

Thermal-Mechanical Analysis of TSV Array in 2.5D Silicon Interposer

Multiphysics Characterization of Polymer‐filled Through‐silicon Vias (pf‐tsvs) for Three‐dimensional Integration

The Embedded Cooling Silicon 3D Stacking Thermal Test Vehicle

Lumped 3-D Equivalent Thermal Circuit Model for Transient Thermal Analysis of TSV Array

Modeling and Characterization of Joule Heating in Metal Core of Tsv

Thermoelectric Coolers for Hotspot Thermal Management of 3D Stacked Chips

Steady state and transient thermal analysis of hot spots in 3D stacked ICs using dedicated test chips

Thermal analysis and heat dissipation optimization of 3D packaging with TSV interposer

Thermal-aware Cell and Through-Silicon-via Co-Placement for 3D ICs.

Investigation of Heat Transfer Performance for Through-Silicon Via Embedded in Micro Pin Fins in 3D Integrated Chips

Thermal Performance of 2.5D Packaging with the Through Glass Via (TGV) Interposer

Electrical-Thermal Co-Simulation For Through Silicon Via And Active Tier In 3-D Ic

The thermal stress analysis in 3D IC integration with TSV interposer

Low Stress TSV Arrays for High-Density Interconnection

The Investigation Of 3d Embedded Microchannel Networks For 3d Ic Cooling, Vacuum Packaging And Thz Passive Device Applications

A Thermal-Driven Test Application Scheme for 3-Dimensional ICs

Assembly and Testing of Thermal Test Chip on Silicon Interposer with Through Silicon Via