Abstract:Over the past few years tremendous progress has been made on the process, application, device physics and compact modeling of nanowire MOSFETs. We would like to review the above aspects of silicon-based nanowire, focusing on its crucial compact models and the circuit performance demonstration based on our group research work and understanding on nanowire MOSFET progress. Nanowire MOSFETs are recognized as one of the most promising candidates to extend Moore’s law into nanoelectronics era. Both the top-down (Singh et al., 2008) and bottom-up (Lu & Lieber, 2006) approaches are widely studied to prepare ultra small nanowire. With bottom-up method, nanowires are generally synthesized by using metal nanoclusters as catalysts via a vapor-liquid-solid process (Lu & Lieber, 2006). After growth nanowires are transferred to silicon substrate to form FET structure. With top-down technique there are various fabrication approaches, such as hard mask trimming, etching in H2 ambient and stress limited oxidation (Singh et al., 2008). 5-nm gate length device has been demonstrated (Liow et al., 2008). Nanowire MOSFETs prepared with both methods find application in logic circuits (Singh et al., 2008), memory (Singh et al., 2008) and sensors (Stern et al., 2008). Due to the quantum confinement in cross section of nanowire MOSFETs, especially of nanowires with diameter smaller than 15nm, electron mobility behaves differently from its bulk counterpart. Phonon-limited electron mobility decreases with reducing the wire size (Kotlyar et al., 2004) while total electron mobility is enhanced due to volume inversion at high transverse field (Jin et al., 2007). Although whether or not ballistic transport can occur in the silicon nanowire MOSFETs with ultrasmall channel length is disputable (Ferry et al., 2008), it deserves our attention. In the ballistic transport regime, carrier scattering in the device channel is totally suppressed. The study of ballistic transport in nanowire MOSFETs provides the upper limit to their performances. Under extreme scaling of nanowire MOSFETs, the atoms in nanowire cross section are countable. It is believed that the change in bandstructure of one dimensional nanowire influences the device performances (Neophytou et al., 2008). The above mentioned phenomenon are studied and simulated with various numerical approaches and also need to be accounted for in the advanced compact models.

Silicon Nanowire Field Effect Devices By Top-Down CMOS Technology

Fully Gate-All-Around Silicon Nanowire Cmos Devices

Si Nanowire CMOS Transistors and Circuits by Top-Down Technology Approach

Gate-All-Around Silicon Nanowire Devices: Are These The Future Of Cmos?

High-performance Fully Depleted Silicon Nanowire (diameter /spl Les/ 5 Nm) Gate-All-around CMOS Devices

Semiconductor Nanowire MOSFETs and Applications

Silicon-Based Nanowire Mosfets: From Process And Device Physics To Simulation And Modeling

CMOS compatible Gate-All-Around Vertical silicon-nanowire MOSFETs

Prospects of Ultra-Thin Nanowire Gated 2D-Fets for Next-Generation CMOS Technology

Three Dimensionally Stacked Sige Nanowire Array And Gate-All-Around P-Mosfets

Vertical Silicon Nanowire CMOS Inverter

A Compact Model of Silicon-Based Nanowire Field Effect Transistor for Circuit Simulation and Design

Investigation of Gate-All-around Silicon Nanowire Transistors for Ultimately Scaled CMOS Technology from Top-Down Approach

III-V Gate-all-around Nanowire MOSFET Process Technology: from 3D to 4D

Performance Breakthrough in 8 Nm Gate Length Gate-All-Around Nanowire Transistors Using Metallic Nanowire Contacts

Top-gated field effect devices using oxidized silicon nanowires

DC baseband and high-frequency characteristics of a silicon nanowire field effect transistor circuit

Enhanced Device Performance with Vertical SiC Gate-All-Around Nanowire Power MOSFETs

Si Nanowire - Array Source Gated Transistors

Self-aligned Multi-Channel Silicon Nanowire Field-Effect Transistors

Nanowire Electronics: From Nanoscale to Macroscale.